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Silicon Packaging Designer (Interposer, Substrate) - Full Time

Company: Rivos
Location: Mountain View
Posted on: June 20, 2022

Job Description:

The individual in this role is responsible for designing interposer, substrate or capacitor technology designs and tapeout.ResponsibilitiesWork with cross-functional teams to select the optimized package solutionWork with IC design, system design, package SI/PI & thermal engineering teams to design custom interposer and substrates.Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate stackup.Own package design deliverables at critical design checkpoints and tape out of package to vendors.RequirementsExperience on interposer and substrate layouts and design in advanced package technologies.Experience with 2.5D, 3D package design.Experience with design teams on floor plan, bump and layout optimization.Strong authority on Cadence Allegro Package Designer (APD)Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated.Ability to work well in a team and be productive under aggressive schedules.Education and ExperienceMaster's Degree with 10+ years of experience in technical subject area

Keywords: Rivos, Mountain View , Silicon Packaging Designer (Interposer, Substrate) - Full Time, Other , Mountain View, California

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