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Electronic Packaging Tech Lead, Google Pixel

Company: Google
Location: Mountain View
Posted on: April 2, 2021

Job Description:

Electronic Packaging Tech Lead, Google Pixel

  • Bachelor's degree in electrical, mechanical, materials science engineering, or equivalent practical experience
  • 7 years of industry experience in finite element (FEM) simulation driven PCB/SIP module packaging development
  • Experience identifying and solving structural/thermal integrity related issues at Silicon/Package/PCB and at solder ball joint level
  • Experienced in modeling mechanical and thermal behavior Preferred qualifications:
    • PhD with academic research in the area of electronic packaging
    • Experience with chip-package-board interactions and Multiphysics simulations
    • Direct experience using Shadow Moire for warpage measurements
    • Ability to make various tradeoffs to define and meet various design goals for cost, manufacturability, and mechanical/thermal reliability About the job Google engineers develop the next-generation technologies that change how users connect, explore, and interact with information and one another. As a member of an extraordinarily creative, motivated and talented team, you develop new products that are used by millions of people. We need our engineers to be versatile and passionate to take on new problems as we continue to push technology forward. If you get excited about building new things and working across discipline lines, then our team might be your next career step. In this role, you will deliver electronic packaging solutions for Google consumer products. You will define future roadmap for advanced packaging while meeting cost, time to market, and quality goals. Google's mission is to organize the world's information and make it universally accessible and useful. Our Devices & Services team combines the best of Google AI, Software, and Hardware to create radically helpful experiences for users. We research, design, and develop new technologies and hardware to make our user's interaction with computing faster, seamless, and more powerful. Whether finding new ways to capture and sense the world around us, advancing form factors, or improving interaction methods, the Devices & Services team is making people's lives better through technology. Responsibilities
      • Work in a System in Package (SIP) development role covering PCB, SIP module, substrate, substrate like PCB (SLP+) and other new interconnect packaging technologies for devices
      • Identify and quantify risks related to mass production readiness, cost, logistics, and time to market
      • Model Coefficient of the Thermal expansion (CTE) mismatch between PCB/substrate materials and propose optimized solutions that meet cost and performance goals
      • Partner with external technology development partners and define goals to accelerate mass production readiness for future packaging solutions to meet cost and time to market and other goals Location Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google's EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing this form . To all recruitment agencies: Google does not accept agency resumes. Please do not forward resumes to our jobs alias, Google employees or any other organization location. Google is not responsible for any fees related to unsolicited resumes.

Keywords: Google, Mountain View , Electronic Packaging Tech Lead, Google Pixel, Other , Mountain View, California

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